Minimum qualifications:

• Bachelor's degree in Mechanical Engineering, Product Design, or in a related field, or equivalent practical experience.
• 5 years of experience in mechanical engineering and design principles, including production, sheet metal, castings, injection molding, structural analysis, and design of cooling solutions.

Preferred qualifications:

• Master's degree in Mechanical Engineering, Product Design, or related field, or equivalent practical experience.
• Experience developing products with high speed signal, power, and cooling interconnects.
• Experience in the mechanical design and engineering of high density, high component count Printed Circuit Board Assembly (PCBA) assemblies.
• Experience in designing electro-mechanical assemblies with an understanding of mechanical tolerances from chip to data center scale, tolerance stackup analysis, quick connect/disconnect technologies and mechanisms.
• Experience in designing thermal solutions for high power ASICS and knowledge of advanced cooling technologies.